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Aries Electronics, Inc.

- Aries is the recognized leading manufacturer of Zero Insertion Force (ZIF) Test Sockets for DIP, PGA, PLCC and SOIC sockets, and continues to be a significant source for a wide variety of specialty electronic connectors. Our corporate objective is to continue to grow within the electronic packaging area, further establishing our position as a major international connector manufacturer.

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Part Number
Manufacturer
Description
Unit Price
In Stock

28-6554-11 28-6554-11

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 55
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : -
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -
0
1622 in stock

28-6574-10 28-6574-10

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 57
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -
0
2 in stock

28-665000-00 28-665000-00

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 665000
Part Status : Active
Convert From (Adapter End) : SOIC-W
Convert To (Adapter End) : SOIC
Number of Pins : 28
Pitch - Mating : 0.050" (1.27mm)
Contact Finish - Mating : -
Mounting Type : Surface Mount
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Tin-Lead
Housing Material : -
Board Material : FR4 Epoxy Glass
0
100 in stock

28-823-90C 28-823-90C

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
0
41 in stock

289-PRS17001-12 289-PRS17001-12

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : PRS
Part Status : Active
Type : PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) : -
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS)
Operating Temperature : -65°C ~ 125°C
0
31 in stock

28-C182-10 28-C182-10

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : EJECT-A-DIP™
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
0
408 in stock

29-003-171 29-003-171

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 171
Part Status : Active
Contact Termination : Solder Tab to Solder Tab
Length : 3.00" (76.20mm)
Number of Positions : 29
Pitch : 0.100" (2.54mm)
0
100 in stock

29-003-172 29-003-172

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 172
Part Status : Active
Contact Termination : Receptacle to Solder Tab
Length : 3.00" (76.20mm)
Number of Positions : 29
Pitch : 0.100" (2.54mm)
0
100 in stock

29-003-173 29-003-173

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 173
Part Status : Active
Contact Termination : Receptacle to Receptacle
Length : 3.00" (76.20mm)
Number of Positions : 29
Pitch : 0.100" (2.54mm)
0
100 in stock

29-006-171 29-006-171

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 171
Part Status : Active
Contact Termination : Solder Tab to Solder Tab
Length : 6.00" (152.40mm)
Number of Positions : 29
Pitch : 0.100" (2.54mm)
0
100 in stock

29-006-172 29-006-172

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 172
Part Status : Active
Contact Termination : Receptacle to Solder Tab
Length : 6.00" (152.40mm)
Number of Positions : 29
Pitch : 0.100" (2.54mm)
0
100 in stock

29-006-173 29-006-173

Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 173
Part Status : Active
Contact Termination : Receptacle to Receptacle
Length : 6.00" (152.40mm)
Number of Positions : 29
Pitch : 0.100" (2.54mm)
0
100 in stock