Aries Electronics, Inc.

- Aries is the recognized leading manufacturer of Zero Insertion Force (ZIF) Test Sockets for DIP, PGA, PLCC and SOIC sockets, and continues to be a significant source for a wide variety of specialty electronic connectors. Our corporate objective is to continue to grow within the electronic packaging area, further establishing our position as a major international connector manufacturer.

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Part Number

Manufacturer

Description

Unit Price

In Stock

28-526-10

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Packaging : Bulk
Series : Lo-PRO®file, 526
Part Status : Active
Type : DIP, ZIF (ZIP)
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C

1712 in stock

28-526-11

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Packaging : Bulk
Series : Lo-PRO®file, 526
Part Status : Active
Type : DIP, ZIF (ZIP)
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 125°C

59 in stock

28-537-20

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Packaging : Bulk
Series : 537
Part Status : Active
Accessory Type : Insert Plate
For Use With/Related Products : PLCC Sockets
Number of Pins : 28
Body Material : Polyphenylene Sulfide (PPS), Glass Filled
Body Finish : -
Color : Black
Features : -

100 in stock

28-555000-00

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Series : Correct-A-Chip® 555000
Part Status : Active
Convert From (Adapter End) : SSOP
Convert To (Adapter End) : SOWIC
Number of Pins : 28
Pitch - Mating : 0.026" (0.65mm)
Contact Finish - Mating : -
Mounting Type : Surface Mount
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Tin-Lead
Housing Material : -
Board Material : FR4 Epoxy Glass

100 in stock

28-600-10

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Packaging : Bulk
Series : 600
Part Status : Active
Connector Type : DIP, DIL - Header
Contact Type : Forked
Number of Positions : 28
Pitch : 0.100" (2.54mm)
Number of Rows : 2
Row Spacing : 0.600" (15.24mm)
Mounting Type : Through Hole
Termination : Solder
Features : -
Contact Finish : Tin
Contact Finish Thickness : 200.0µin (5.08µm)
Color : Black

100 in stock

28-650000-10

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Series : Correct-A-Chip® 650000
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SOIC
Number of Positions : 28
Pitch : 0.050" (1.27mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 2.800" L x 0.480" W (71.12mm x 12.19mm)

1323 in stock

28-650000-11-RC

Aries Electronics, Inc.

190 in stock

28-650-10

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Series : 650
Part Status : Active
Accessory Type : Cap (Cover)
Number of Positions : 28
For Use With/Related Products : 0600 Series Header
Features : -

110 in stock

28-651000-11-RC

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Series : Correct-A-Chip® 651000
Part Status : Obsolete
Convert From (Adapter End) : SSOP
Convert To (Adapter End) : DIP, 0.6" (15.24mm) Row Spacing
Number of Pins : 28
Pitch - Mating : 0.026" (0.65mm)
Contact Finish - Mating : -
Mounting Type : Through Hole
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Housing Material : -
Board Material : FR4 Epoxy Glass

100 in stock

28-6518-10

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -

3222 in stock

28-653000-10

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Series : Correct-A-Chip® 653000
Part Status : Active
Convert From (Adapter End) : PLCC
Convert To (Adapter End) : DIP, 0.6" (15.24mm) Row Spacing
Number of Pins : 28
Pitch - Mating : 0.050" (1.27mm)
Contact Finish - Mating : -
Mounting Type : Through Hole
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Housing Material : -
Board Material : FR4 Epoxy Glass

228 in stock

28-6554-10

Aries Electronics, Inc.

Manufacturer : Aries Electronics
Packaging : Bulk
Series : 55
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 28 (2 x 14)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -

169 in stock