Aries Electronics, Inc.
- Aries is the recognized leading manufacturer of Zero Insertion Force (ZIF) Test Sockets for DIP, PGA, PLCC and SOIC sockets, and continues to be a significant source for a wide variety of specialty electronic connectors. Our corporate objective is to continue to grow within the electronic packaging area, further establishing our position as a major international connector manufacturer.
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Part Number
Manufacturer
Description
Unit Price
In Stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
94 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Lo-PRO®file, 526
Part Status : Active
Type : DIP, ZIF (ZIP)
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
0
45 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 600
Part Status : Active
Connector Type : DIP, DIL - Header
Contact Type : Forked
Number of Positions : 24
Pitch : 0.100" (2.54mm)
Number of Rows : 2
Row Spacing : 0.600" (15.24mm)
Mounting Type : Through Hole
Termination : Solder
Features : -
Contact Finish : Tin
Contact Finish Thickness : 200.0µin (5.08µm)
Color : Black
0
293 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 600
Part Status : Active
Connector Type : DIP, DIL - Header
Contact Type : Post
Number of Positions : 24
Pitch : 0.100" (2.54mm)
Number of Rows : 2
Row Spacing : 0.600" (15.24mm)
Mounting Type : Through Hole
Termination : Solder
Features : -
Contact Finish : Tin
Contact Finish Thickness : 200.0µin (5.08µm)
Color : Black
0
376 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 650000
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SOIC
Number of Positions : 24
Pitch : 0.050" (1.27mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 2.400" L x 0.480" W (60.96mm x 12.19mm)
0
1209 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 650
Part Status : Active
Accessory Type : Cap (Cover)
Number of Positions : 24
For Use With/Related Products : 0600 Series Header
Features : -
0
13 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 650
Part Status : Active
Accessory Type : Cap (Cover)
Number of Positions : 24
For Use With/Related Products : 0600 Series Header
Features : -
0
128 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 651000
Part Status : Active
Convert From (Adapter End) : SSOP
Convert To (Adapter End) : DIP, 0.6" (15.24mm) Row Spacing
Number of Pins : 24
Pitch - Mating : 0.026" (0.65mm)
Contact Finish - Mating : -
Mounting Type : Through Hole
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Housing Material : -
Board Material : FR4 Epoxy Glass
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
197 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 55
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -
0
252 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 55
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : -
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -
0
252 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 55
Part Status : Active
Type : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Nickel Boron
Contact Finish Thickness - Mating : 50.0µin (1.27µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Nickel Boron
Contact Finish Thickness - Post : 50.0µin (1.27µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -
0
60 in stock
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