Aries Electronics, Inc.
- Aries is the recognized leading manufacturer of Zero Insertion Force (ZIF) Test Sockets for DIP, PGA, PLCC and SOIC sockets, and continues to be a significant source for a wide variety of specialty electronic connectors. Our corporate objective is to continue to grow within the electronic packaging area, further establishing our position as a major international connector manufacturer.
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Part Number
Manufacturer
Description
Unit Price
In Stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 172
Part Status : Active
Contact Termination : Receptacle to Solder Tab
Length : 12.00" (304.80mm)
Number of Positions : 24
Pitch : 0.100" (2.54mm)
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 173
Part Status : Active
Contact Termination : Receptacle to Receptacle
Length : 12.00" (304.80mm)
Number of Positions : 24
Pitch : 0.100" (2.54mm)
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 350000
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SOIC
Number of Positions : 24
Pitch : 0.050" (1.27mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 2.400" L x 0.450" W (60.96mm x 11.43mm)
0
130 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 350000
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SOIC
Number of Positions : 24
Pitch : 0.050" (1.27mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 2.400" L x 0.450" W (60.96mm x 11.43mm)
0
747 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
194 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 354000
Part Status : Active
Convert From (Adapter End) : DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End) : SOIC
Number of Pins : 24
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Mounting Type : Surface Mount
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Gold
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material : -
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 354000
Part Status : Active
Convert From (Adapter End) : DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End) : SOIC
Number of Pins : 24
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Mounting Type : Surface Mount
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Gold
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material : -
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 354000
Part Status : Active
Convert From (Adapter End) : DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End) : SOIC
Number of Pins : 24
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Mounting Type : Surface Mount
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Gold
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material : -
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 354000
Part Status : Active
Convert From (Adapter End) : DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End) : SOIC
Number of Pins : 24
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Mounting Type : Surface Mount
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Gold
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material : -
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 354W00
Part Status : Active
Convert From (Adapter End) : DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End) : SOWIC
Number of Pins : 24
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Mounting Type : Through Hole
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Tin-Lead
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material : -
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 354W00
Part Status : Active
Convert From (Adapter End) : DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End) : SOWIC
Number of Pins : 24
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Mounting Type : Through Hole
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Tin-Lead
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Board Material : -
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 35W000
Part Status : Active
Convert From (Adapter End) : SOIC-W
Convert To (Adapter End) : DIP, 0.3" (7.62mm) Row Spacing
Number of Pins : 24
Pitch - Mating : 0.050" (1.27mm)
Contact Finish - Mating : -
Mounting Type : Through Hole
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Housing Material : -
Board Material : FR4 Epoxy Glass
0
100 in stock
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