Aries Electronics, Inc.
- Aries is the recognized leading manufacturer of Zero Insertion Force (ZIF) Test Sockets for DIP, PGA, PLCC and SOIC sockets, and continues to be a significant source for a wide variety of specialty electronic connectors. Our corporate objective is to continue to grow within the electronic packaging area, further establishing our position as a major international connector manufacturer.
Image
Part Number
Manufacturer
Description
Unit Price
In Stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 172
Part Status : Active
Contact Termination : Receptacle to Solder Tab
Length : 12.00" (304.80mm)
Number of Positions : 20
Pitch : 0.100" (2.54mm)
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 173
Part Status : Active
Contact Termination : Receptacle to Receptacle
Length : 12.00" (304.80mm)
Number of Positions : 20
Pitch : 0.100" (2.54mm)
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 511
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 20 (1 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 50.0µin (1.27µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole
Features : -
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 50.0µin (1.27µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
0
1142 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 20 (1 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
75 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 20 (1 x 20)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
73 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 0600
Part Status : Active
Connector Type : DIP, DIL - Header
Contact Type : Post
Number of Positions : 20
Pitch : 0.100" (2.54mm)
Number of Rows : 1
Row Spacing : -
Mounting Type : Through Hole
Termination : Solder
Features : -
Contact Finish : Gold
Contact Finish Thickness : 10.0µin (0.25µm)
Color : Black
0
131 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 301550
Part Status : Active
Convert From (Adapter End) : SOIC
Convert To (Adapter End) : PLCC
Number of Pins : 20
Pitch - Mating : 0.050" (1.27mm)
Contact Finish - Mating : -
Mounting Type : Through Hole
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Housing Material : -
Board Material : FR4 Epoxy Glass
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 301550
Part Status : Active
Convert From (Adapter End) : SOIC
Convert To (Adapter End) : PLCC
Number of Pins : 20
Pitch - Mating : 0.050" (1.27mm)
Contact Finish - Mating : -
Mounting Type : Through Hole
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Housing Material : -
Board Material : FR4 Epoxy Glass
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 350000
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SOIC
Number of Positions : 20
Pitch : 0.050" (1.27mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 2.000" L x 0.450" W (50.80mm x 11.43mm)
0
71 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 350000
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SOIC
Number of Positions : 20
Pitch : 0.050" (1.27mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : FR4 Epoxy Glass
Size / Dimension : 2.000" L x 0.450" W (50.80mm x 11.43mm)
0
185 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 351000
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SSOP
Number of Positions : 20
Pitch : 0.026" (0.65mm)
Board Thickness : 0.062" (1.57mm) 1/16"
Material : -
Size / Dimension : 2.000" L x 0.400" W (50.80mm x 10.16mm)
0
344 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 20 (2 x 10)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
1810 in stock
New Original Stock
Competitive Prices
One-stop
Customer Service
