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DRV8870DDARATMEGA328PAD7689BCPZRL7 TCAN1042VDRQ1STM32F103C8T6
Category
  • Solder Stencils, Templates
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Part Number
Manufacturer
Description
Unit Price
In Stock
Picture of PA0116-S

PA0116-S PA0116-S

Chip Quik, Inc.
Type : CSP
Number of Positions : 24
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.138" L x 0.177" W (3.50mm x 4.50mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0117-S

PA0117-S PA0117-S

Chip Quik, Inc.
Type : CSP
Number of Positions : 28
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.177" L x 0.217" W (4.50mm x 5.50mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0118-S

PA0118-S PA0118-S

Chip Quik, Inc.
Type : CSP
Number of Positions : 48
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.276" L x 0.276" W (7.00mm x 7.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0119-S

PA0119-S PA0119-S

Chip Quik, Inc.
Type : CSP
Number of Positions : 20
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.138" L x 0.138" W (3.50mm x 3.50mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0120-S

PA0120-S PA0120-S

Chip Quik, Inc.
Type : CSP
Number of Positions : 32
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.177" L x 0.217" W (4.50mm x 5.50mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0121-S

PA0121-S PA0121-S

Chip Quik, Inc.
Type : LQFP
Number of Positions : 128
Pitch : 0.020" (0.50mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : 0.551" L x 0.787" W (14.00mm x 20.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0122-S

PA0122-S PA0122-S

Chip Quik, Inc.
Type : LQFP
Number of Positions : 128
Pitch : 0.020" (0.50mm)
Outer Dimension : 1.350" L x 1.950" W (34.29mm x 49.53mm)
Inner Dimension : 0.787" L x 0.787" W (20.00mm x 20.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0132-S

PA0132-S PA0132-S

Chip Quik, Inc.
Type : LLP
Number of Positions : 6
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.079" L x 0.079" W (2.00mm x 2.00mm)
Thermal Center Pad : -
0
100 in stock
Picture of PA0133-S

PA0133-S PA0133-S

Chip Quik, Inc.
Type : LLP
Number of Positions : 6
Pitch : 0.026" (0.65mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.087" L x 0.098" W (2.20mm x 2.50mm)
Thermal Center Pad : 0.030" L x 0.197" W (0.75mm x 5.00mm)
0
100 in stock
Picture of PA0134-S

PA0134-S PA0134-S

Chip Quik, Inc.
Type : LLP
Number of Positions : 8
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : 0.063" L x 0.236" W (1.60mm x 6.00mm)
0
100 in stock
Picture of PA0135-S

PA0135-S PA0135-S

Chip Quik, Inc.
Type : LLP
Number of Positions : 10
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : 0.063" L x 0.236" W (1.60mm x 6.00mm)
0
100 in stock
Picture of PA0136-S

PA0136-S PA0136-S

Chip Quik, Inc.
Type : LLP
Number of Positions : 12
Pitch : 0.016" (0.40mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad : 0.063" L x 0.236" W (1.60mm x 6.00mm)
0
100 in stock
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