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PA0155-S

Manufacturer: Chip Quik, Inc.
PA0155-S
Type : BGA
Number of Positions : 8
Pitch : 0.020" (0.50mm)
Outer Dimension : 0.900" L x 1.300" W (22.86mm x 33.02mm)
Inner Dimension : 0.054" L x 0.054" W (1.36mm x 1.36mm)
Thermal Center Pad : -
Availability: 100 in stock
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