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Logical Systems

- Logical Systems Corporation has been in business since 1982 and has designed and manufactured adapters since 1987. We offer IC programming adapters, emulator adapters, prototyping adapters, SMT to through hole package converters and test sockets. We offer custom design services for all IC packages. We operate in-house design and production facilities and offer some chip programming and assembly services. We have distributors in over 30 countries worldwide and our products can be purchased through Digi-Key within the U.S.

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Part Number
Manufacturer
Description
Unit Price
In Stock

PA-SSD3SM18-16 PA-SSD3SM18-16

Logical Systems
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SSOP, TSSOP
Number of Positions : 16
Pitch : 0.026" (0.65mm)
Board Thickness : -
Material : -
Size / Dimension : 0.850" L x 0.450" W (21.59mm x 11.43mm)
0
134 in stock

PA-SSD3SM18-18 PA-SSD3SM18-18

Logical Systems
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SSOP, TSSOP
Number of Positions : 18
Pitch : 0.026" (0.65mm)
Board Thickness : -
Material : -
Size / Dimension : 0.950" L x 0.950" W (24.13mm x 11.43mm)
0
14 in stock

PA-SSD3SM18-20 PA-SSD3SM18-20

Logical Systems
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SSOP, TSSOP
Number of Positions : 20
Pitch : 0.026" (0.65mm)
Board Thickness : -
Material : -
Size / Dimension : 1.050" L x 0.450" W (26.67mm x 11.43mm)
0
220 in stock

PA-SSD3SM18-24 PA-SSD3SM18-24

Logical Systems
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SSOP, TSSOP
Number of Positions : 24
Pitch : 0.026" (0.65mm)
Board Thickness : -
Material : -
Size / Dimension : 1.250" L x 0.450" W (31.75mm x 11.43mm)
0
100 in stock

PA-SSD3SM18-28 PA-SSD3SM18-28

Logical Systems
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SSOP, TSSOP
Number of Positions : 28
Pitch : 0.026" (0.65mm)
Board Thickness : -
Material : -
Size / Dimension : 1.450" L x 0.450" W (36.83mm x 11.43mm)
0
16 in stock

PA-SSD6SM18-24 PA-SSD6SM18-24

Logical Systems
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SSOP, TSSOP
Number of Positions : 24
Pitch : 0.026" (0.65mm)
Board Thickness : -
Material : -
Size / Dimension : 1.250" L x 0.750" W (31.75mm x 19.05mm)
0
40 in stock

PA-SSD6SM18-28 PA-SSD6SM18-28

Logical Systems
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SSOP, TSSOP
Number of Positions : 28
Pitch : 0.026" (0.65mm)
Board Thickness : -
Material : -
Size / Dimension : 1.450" L x 0.750" W (36.83mm x 19.05mm)
0
5 in stock

PA-SSD6SM18-32 PA-SSD6SM18-32

Logical Systems
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SSOP, TSSOP
Number of Positions : 32
Pitch : 0.026" (0.65mm)
Board Thickness : -
Material : -
Size / Dimension : 1.650" L x 0.750" W (41.91mm x 19.05mm)
0
6 in stock

PA-SSD6SM18-40 PA-SSD6SM18-40

Logical Systems
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : SSOP, TSSOP
Number of Positions : 40
Pitch : 0.026" (0.65mm)
Board Thickness : -
Material : -
Size / Dimension : 2.050" L x 0.750" W (50.80mm x 19.05mm)
0
2 in stock

PA-TS1D6SM18-32 PA-TS1D6SM18-32

Logical Systems
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Proto Board Type : SMD to DIP
Package Accepted : TSOP
Number of Positions : 32
Pitch : 0.020" (0.50mm)
Board Thickness : -
Material : -
Size / Dimension : 1.650" L x 0.750" W (41.91mm x 19.05mm)
0
3 in stock

PA-TS1D6SM18-40 PA-TS1D6SM18-40

Logical Systems
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Convert From (Adapter End) : TSOP
Convert To (Adapter End) : DIP
Number of Pins : 40
Pitch - Mating : 0.020" (0.50mm)
Contact Finish - Mating : -
Mounting Type : Through Hole
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : -
Housing Material : -
Board Material : -
0
100 in stock

PA-TS1D6SM18-56 PA-TS1D6SM18-56

Logical Systems
Manufacturer : Logical Systems Inc.
Series : -
Part Status : Active
Convert From (Adapter End) : TSOP
Convert To (Adapter End) : DIP
Number of Pins : 56
Pitch - Mating : 0.020" (0.50mm)
Contact Finish - Mating : -
Mounting Type : Through Hole
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : -
Housing Material : -
Board Material : -
0
100 in stock