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Chip Quik, Inc.

- Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.

Chip Quik®, along with its partner Proto Advantage offers solder paste, solder wire, tacky flux, removal kits, SMT to DIP adapters, SMT to SIP adapters, and breadboards.

Chip Quik and Proto Advantage can now meet all of your rework and prototyping needs.

Our expertise in electronic rework, repair, and prototyping enables us to meet the needs of the industry through continuous development of products and methods.

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Part Number
Manufacturer
Description
Unit Price
In Stock

TS391AX TS391AX

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn63Pb37 (63/37)
Diameter : -
Melting Point : 361°F (183°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Leaded
Form : Syringe, 0.53 oz (15g), 5cc
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
57 in stock

TS391AX10 TS391AX10

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn63Pb37 (63/37)
Diameter : -
Melting Point : 361°F (183°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Leaded
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
86 in stock

TS391AX250 TS391AX250

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn63Pb37 (63/37)
Diameter : -
Melting Point : 361°F (183°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Leaded
Form : Jar, 8.8 oz (250g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
13 in stock

TS391AX50 TS391AX50

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn63Pb37 (63/37)
Diameter : -
Melting Point : 361°F (183°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Leaded
Form : Jar, 1.76 oz (50g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
78 in stock

TS391AX500C TS391AX500C

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn63Pb37 (63/37)
Diameter : -
Melting Point : 361°F (183°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Leaded
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
7 in stock

TS391LT TS391LT

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 0.53 oz (15g), 5cc
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
144 in stock

TS391LT10 TS391LT10

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
43 in stock

TS391LT250 TS391LT250

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 8.8 oz (250g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
28 in stock

TS391LT50 TS391LT50

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Jar, 1.76 oz (50g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
74 in stock

TS391LT500C TS391LT500C

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter : -
Melting Point : 281°F (138°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Cartridge, 17.64 oz (500g)
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
3 in stock

TS391SNL TS391SNL

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 0.53 oz (15g), 5cc
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
270 in stock

TS391SNL10 TS391SNL10

Chip Quik, Inc.
Manufacturer : Chip Quik Inc.
Series : -
Part Status : Active
Type : Solder Paste
Composition : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter : -
Melting Point : 423 ~ 428°F (217 ~ 220°C)
Flux Type : No-Clean
Wire Gauge : -
Process : Lead Free
Form : Syringe, 1.23 oz (35g), 10cc
Shelf Life : 12 Months
Shelf Life Start : Date of Manufacture
Storage/Refrigeration Temperature : 68°F ~ 77°F (20°C ~ 25°C)
0
26 in stock