Aries Electronics, Inc.
- Aries is the recognized leading manufacturer of Zero Insertion Force (ZIF) Test Sockets for DIP, PGA, PLCC and SOIC sockets, and continues to be a significant source for a wide variety of specialty electronic connectors. Our corporate objective is to continue to grow within the electronic packaging area, further establishing our position as a major international connector manufacturer.
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Part Number
Manufacturer
Description
Unit Price
In Stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 171
Part Status : Active
Contact Termination : Solder Tab to Solder Tab
Length : 32.00" (812.80mm)
Number of Positions : 10
Pitch : 0.100" (2.54mm)
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 173
Part Status : Active
Contact Termination : Receptacle to Receptacle
Length : 33.00" (838.20mm)
Number of Positions : 10
Pitch : 0.100" (2.54mm)
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : 518
Part Status : Active
Type : SIP
Number of Positions or Pins (Grid) : 10 (1 x 10)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
858 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : 173
Part Status : Active
Contact Termination : Receptacle to Receptacle
Length : 66.00" (1.68m)
Number of Positions : 10
Pitch : 0.100" (2.54mm)
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Lo-PRO®file, 513
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
175 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Vertical
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
0
211 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole, Right Angle, Vertical
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -
0
1461 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Vertical
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
0
2666 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0µin (0.76µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature : -55°C ~ 105°C
0
233 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
0
268 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Packaging : Bulk
Series : Vertisockets™800
Part Status : Active
Type : DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid) : 10 (2 x 5)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole, Right Angle, Horizontal
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polyamide (PA46), Nylon 4/6
Operating Temperature : -
0
100 in stock
Aries Electronics, Inc.
Manufacturer : Aries Electronics
Series : Correct-A-Chip® 350000
Part Status : Active
Convert From (Adapter End) : SOIC
Convert To (Adapter End) : DIP, 0.3" (7.62mm) Row Spacing
Number of Pins : 10
Pitch - Mating : 0.050" (1.27mm)
Contact Finish - Mating : Tin
Mounting Type : Through Hole
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Housing Material : -
Board Material : Polyimide (PI)
0
100 in stock
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